Intel?s 3D Transistors Promise Small Physical And Electrical Footprint

Intel has made an interesting advance in microprocessor technology after years of research, and it seems that 2011's processors will be the first to feature 3D transistors and tri-gate technology. By optimizing the shape of the transistor at a nanometer level, Intel has made it possible to both reduce the size of individual transistors and improve their efficiency. Now, it's important to differentiate this 3D method from others under investigation, like IBM's. This isn't a multi-layer solution, merely a more complicated shape for the single layer of transistors we know and love. I say merely, but of course sculpting things at a near-atomic level is no joke. So what exactly is the advance here, and what will it enable?

Source: http://feedproxy.google.com/~r/Techcrunch/~3/YrTux7eR0N8/

VERIFONE HOLDINGS VEECO INSTRUMENTS VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES UNITED ONLINE UNISYS TRIQUINT SEMICONDUCTOR